Semiconductor Failure Analysis
3D x-ray microscopy has become the workhorse approach to investigating failures such as cracks and voids in semiconductor packaging. Sigray PrismaXRM offers the leading resolution, contrast, and resolution needed for quickly identifying the failure modes. In addition, the system’s novel tri-contrast enables rapid identification from a 2D radiography – without requiring a complete tomography.
Virtual slice of logic routing and vias of commercial SDD
Carbon Fiber Reinforced Composites

Carbon fiber reinforced polymers (CFRPs) are extremely challenging to image with conventional x-ray techniques, such as microCT, due to the low absorption of carbon fibers and the surrounding polymer matrix. Quantitative Phase™ and Subresolution Darkfield™ images acquired with the PrismaXRM provide measurements of defects and fiber orientation that cannot be observed using high-resolution absorption contrast, due to the low x-ray contrast between carbon fibers and polymers.
Demonstration of the power of the Quantitative Phase and Subresolution Darkfield capabilities applied to an angle-interlock woven CFRP. All three images were acquired simultaneously in the PrismaXRM. Absorption contrast (what is acquired with conventional microCT) has limited contrast, while the other two images provide information on materials, weaves, and fiber orientations.
In-situ Microstructural Evolution
A significant advantage of PrismaXRM’s design is to retain high submicron resolutions for large samples, enabling high fidelity imaging of samples placed in larger in-situ cells. The 3D microstructural evolution can be imaged of samples under various conditions, including: heating, cooling, tension & compression, and more. We will provide robust in-situ solutions for your needs.